An inkjet printed piezoresistive back-to-back graphene tactile sensor for endosurgical palpation applications

Yu Min Fu, Meng Chuin Chou, Yu Ting Cheng, Ethan B. Secor, Mark C Hersam

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The paper presents a tactile sensor design mimicking human finger touch to differentiate tissue hardness for endosurgical palpation applications. The sensor comprises two inkjet-printed piezoresistive graphene-based sensing elements linked back-to-back for force and displacement detection, respectively. Experimental results indicate the sensor registers 2.1 and 5.3 mN force feedback from the fat and muscle tissues of pig, respectively, when pressed to the tissues with the same 100 μm displacement. This difference of ∼2.5 times in force feedback provides a compelling method by which doctors can more intuitively perceive hardness and tissue differences during endosurgery in comparison with the prior arts.

Original languageEnglish
Title of host publication2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages612-615
Number of pages4
ISBN (Electronic)9781509050789
DOIs
Publication statusPublished - Feb 23 2017
Event30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017 - Las Vegas, United States
Duration: Jan 22 2017Jan 26 2017

Other

Other30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017
CountryUnited States
CityLas Vegas
Period1/22/171/26/17

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

Fu, Y. M., Chou, M. C., Cheng, Y. T., Secor, E. B., & Hersam, M. C. (2017). An inkjet printed piezoresistive back-to-back graphene tactile sensor for endosurgical palpation applications. In 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017 (pp. 612-615). [7863482] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMSYS.2017.7863482