Assembly of micropatterned colloidal gold thin films via microtransfer molding and electrophoretic deposition

Ryan C. Bailey, Keith J. Stevenson, Joseph T. Hupp

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The controlled fabrication of ultra-thin micropatterned colloidal gold films on conductive platforms was studied using a combination of microtransfer molding and electrophoretic deposition techniques.The assembly of colloidal gold thin films was based on absorption from colloidal solutions onto chemically derivatized surfaces. The directional force drove the suspended nanoscopic particles towards the surface due to the action of charged colloidal metal particles.

Original languageEnglish
Pages (from-to)1930-1934
Number of pages5
JournalAdvanced Materials
Issue number24
Publication statusPublished - Dec 15 2000


ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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