Assembly of micropatterned colloidal gold thin films via microtransfer molding and electrophoretic deposition

Ryan C. Bailey, Keith J. Stevenson, Joseph T Hupp

Research output: Contribution to journalArticle

68 Citations (Scopus)

Abstract

The controlled fabrication of ultra-thin micropatterned colloidal gold films on conductive platforms was studied using a combination of microtransfer molding and electrophoretic deposition techniques.The assembly of colloidal gold thin films was based on absorption from colloidal solutions onto chemically derivatized surfaces. The directional force drove the suspended nanoscopic particles towards the surface due to the action of charged colloidal metal particles.

Original languageEnglish
Pages (from-to)1930-1934
Number of pages5
JournalAdvanced Materials
Volume12
Issue number24
DOIs
Publication statusPublished - Dec 15 2000

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Gold Colloid
Molding
Gold
Thin films
Metals
Fabrication

ASJC Scopus subject areas

  • Materials Science(all)

Cite this

Assembly of micropatterned colloidal gold thin films via microtransfer molding and electrophoretic deposition. / Bailey, Ryan C.; Stevenson, Keith J.; Hupp, Joseph T.

In: Advanced Materials, Vol. 12, No. 24, 15.12.2000, p. 1930-1934.

Research output: Contribution to journalArticle

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