Bonding of noble metals to semiconductor surfaces: First-principles calculations of Cu and Ag on Si(111)

Shih Hung Chou, Arthur J Freeman, S. Grigoras, T. M. Gentle, B. Delley, E. Wimmer

Research output: Contribution to journalArticle

17 Citations (Scopus)
Original languageEnglish
Pages (from-to)1880-1881
Number of pages2
JournalJournal of the American Chemical Society
Volume109
Issue number6
Publication statusPublished - 1987

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Semiconductors
Precious metals
Metals
Semiconductor materials

ASJC Scopus subject areas

  • Chemistry(all)

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Bonding of noble metals to semiconductor surfaces : First-principles calculations of Cu and Ag on Si(111). / Chou, Shih Hung; Freeman, Arthur J; Grigoras, S.; Gentle, T. M.; Delley, B.; Wimmer, E.

In: Journal of the American Chemical Society, Vol. 109, No. 6, 1987, p. 1880-1881.

Research output: Contribution to journalArticle

Chou, Shih Hung ; Freeman, Arthur J ; Grigoras, S. ; Gentle, T. M. ; Delley, B. ; Wimmer, E. / Bonding of noble metals to semiconductor surfaces : First-principles calculations of Cu and Ag on Si(111). In: Journal of the American Chemical Society. 1987 ; Vol. 109, No. 6. pp. 1880-1881.
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