Chemical, structural, and quantitative analysis of the ligand shells of colloidal quantum dots

Adam J. Morris-Cohen, Michał Malicki, Mark D. Peterson, John W J Slavin, Emily A Weiss

Research output: Contribution to journalArticle

115 Citations (Scopus)

Abstract

This review outlines the set of technical approaches to answering three major questions about the surface chemistry of colloidal semiconductor quantum dots (QDs): (i) What is the chemical structure of the ligands on the surface of the QD? (ii) How many of each type of ligand are on the surface of the QD? (iii) What is the intermolecular structure (geometry) of the ligands on the surface of the QD? Each section addresses the accessability of the relevant techniques - which include 1D and 2D NMR, vibrational and electronic absorption and transient absorption spectroscopies, and various elemental analyses - and their sensitivity and applicability to the specified observable of interest.

Original languageEnglish
Pages (from-to)1155-1165
Number of pages11
JournalChemistry of Materials
Volume25
Issue number8
DOIs
Publication statusPublished - Apr 23 2013

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Structural analysis
Semiconductor quantum dots
Ligands
Chemical analysis
Surface chemistry
Absorption spectroscopy
Nuclear magnetic resonance
Geometry

Keywords

  • elemental analysis
  • NMR
  • quantum dot
  • transient absorption spectroscopy

ASJC Scopus subject areas

  • Materials Chemistry
  • Chemical Engineering(all)
  • Chemistry(all)

Cite this

Chemical, structural, and quantitative analysis of the ligand shells of colloidal quantum dots. / Morris-Cohen, Adam J.; Malicki, Michał; Peterson, Mark D.; Slavin, John W J; Weiss, Emily A.

In: Chemistry of Materials, Vol. 25, No. 8, 23.04.2013, p. 1155-1165.

Research output: Contribution to journalArticle

Morris-Cohen, Adam J. ; Malicki, Michał ; Peterson, Mark D. ; Slavin, John W J ; Weiss, Emily A. / Chemical, structural, and quantitative analysis of the ligand shells of colloidal quantum dots. In: Chemistry of Materials. 2013 ; Vol. 25, No. 8. pp. 1155-1165.
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