Electrical characterization of Si Microwires and of Si microwire/conducting polymer composite junctions

Iman Yahyaie, Kevin McEleney, Michael Walter, Derek R. Oliver, Douglas J. Thomson, Michael S. Freund, Nathan S Lewis

Research output: Contribution to journalArticle

17 Citations (Scopus)

Abstract

The electrical (DC) behavior of single silicon microwires has been determined by the use of tungsten probes to make ohmic contact to the silicon microwires. The basic electrical properties of the microwires, such as their DC resistivity and the doping distribution along the length of the microwires, were investigated using this approach. The technique was also used to characterize the junction between silicon microwires and conducting polymers to assess the suitability of such contacts for use in a proposed artificial photosynthesis system.

Original languageEnglish
Pages (from-to)675-680
Number of pages6
JournalJournal of Physical Chemistry Letters
Volume2
Issue number6
DOIs
Publication statusPublished - Mar 17 2011

Fingerprint

Conducting polymers
conducting polymers
Silicon
direct current
silicon polymers
composite materials
photosynthesis
Composite materials
silicon
electric contacts
tungsten
Tungsten
Photosynthesis
Ohmic contacts
electrical properties
electrical resistivity
probes
Electric properties
Doping (additives)

ASJC Scopus subject areas

  • Materials Science(all)

Cite this

Electrical characterization of Si Microwires and of Si microwire/conducting polymer composite junctions. / Yahyaie, Iman; McEleney, Kevin; Walter, Michael; Oliver, Derek R.; Thomson, Douglas J.; Freund, Michael S.; Lewis, Nathan S.

In: Journal of Physical Chemistry Letters, Vol. 2, No. 6, 17.03.2011, p. 675-680.

Research output: Contribution to journalArticle

Yahyaie, Iman ; McEleney, Kevin ; Walter, Michael ; Oliver, Derek R. ; Thomson, Douglas J. ; Freund, Michael S. ; Lewis, Nathan S. / Electrical characterization of Si Microwires and of Si microwire/conducting polymer composite junctions. In: Journal of Physical Chemistry Letters. 2011 ; Vol. 2, No. 6. pp. 675-680.
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