Electrochemical assembly of metallopolymeric films via reduction of coordinated 5-chlorophenanthroline

Odette Fussa-Rydel, Hai Tao Zhang, Joseph T Hupp, Charles R. Leidner

Research output: Contribution to journalArticle

61 Citations (Scopus)

Abstract

Electrochemical reduction of iron, osmium, and ruthenium complexes containing the ligand 5-chlorophenanthroline leads to the controlled growth of metallopolymers as electrode coatings. The coatings are electroactive and display a reversible electrochromic effect upon metal oxidation. Auger electron spectroscopy studies show that the polymerization mechanism involves carbon-chlorine bond cleavage and the generation of exchangeable chloride ions. The proposed linkage mechanisms involve direct carbon-carbon coupling of phenanthroline ligands. The possible utility of these new polymers in redox conductivity studies and in microstructure fabrication is noted.

Original languageEnglish
Pages (from-to)1533-1537
Number of pages5
JournalInorganic Chemistry
Volume28
Issue number8
Publication statusPublished - 1989

Fingerprint

Carbon
assembly
carbon
Ligands
Osmium
coatings
Coatings
ligands
Phenanthrolines
Ruthenium
osmium
Chlorine
Auger electron spectroscopy
linkages
ruthenium
Auger spectroscopy
chlorine
electron spectroscopy
Chlorides
cleavage

ASJC Scopus subject areas

  • Inorganic Chemistry

Cite this

Electrochemical assembly of metallopolymeric films via reduction of coordinated 5-chlorophenanthroline. / Fussa-Rydel, Odette; Zhang, Hai Tao; Hupp, Joseph T; Leidner, Charles R.

In: Inorganic Chemistry, Vol. 28, No. 8, 1989, p. 1533-1537.

Research output: Contribution to journalArticle

Fussa-Rydel, Odette ; Zhang, Hai Tao ; Hupp, Joseph T ; Leidner, Charles R. / Electrochemical assembly of metallopolymeric films via reduction of coordinated 5-chlorophenanthroline. In: Inorganic Chemistry. 1989 ; Vol. 28, No. 8. pp. 1533-1537.
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