Epitaxial Si-Ge etch stop layers with ethylene diamine pyrocatechol for bonded and etchback silicon-on-lnsulator

D. Feijóo, J. C. Bean, L. J. Peticolas, L. C. Feldman, W. C. Liang

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

The etch rate in ethylene diamine pyrocatechol of Si1-xGe1-x (0.2 ≤ x< - 0.3) etch stops grown by molecular beam epitaxy was determined using Rutherford backscattering spectrometry. Etch rate selectivities as high as 390 were measured. Such etch stops allow for higher bonding temperatures than those possible with currently used boron-based etch stops. Defect etching was used to determine the maximal thickness of dislocation-free layers.

Original languageEnglish
Pages (from-to)493-496
Number of pages4
JournalJournal of Electronic Materials
Volume23
Issue number6
DOIs
Publication statusPublished - Jun 1 1994

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Keywords

  • Bonded and etchback silicon-on-insulator (BE-SOI)
  • SiGe
  • etch stop
  • ethylene diamine pyrocatechol
  • silicon-on-insulator
  • wafer bonding

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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