Fragmentation and recombination of copper dimers deposited on an ar film

M. Ratner, W. Harbich, S. Fedrigo

Research output: Contribution to journalArticlepeer-review

17 Citations (Scopus)


The collision between a copper dimer and an Ar film is investigated by molecular-dynamics simulations. A dimer fragmentation rate of 24% is found for an impact kinetic energy of 25 eV per atom, in agreement with previous experimental results. Temporary dissociation of the dimer followed by a reaggregation is observed in 14% of the cases. The collision induces a fast superheating of the Ar film around the impact point followed by a liquefaction. The cooling rate of the copper dimer is found to be one order lower than the cooling rate of the Ar film in the impact area.

Original languageEnglish
Pages (from-to)11730-11733
Number of pages4
JournalPhysical Review B - Condensed Matter and Materials Physics
Issue number16
Publication statusPublished - 1999

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

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