Abstract
The collision between a copper dimer and an Ar film is investigated by molecular-dynamics simulations. A dimer fragmentation rate of 24% is found for an impact kinetic energy of 25 eV per atom, in agreement with previous experimental results. Temporary dissociation of the dimer followed by a reaggregation is observed in 14% of the cases. The collision induces a fast superheating of the Ar film around the impact point followed by a liquefaction. The cooling rate of the copper dimer is found to be one order lower than the cooling rate of the Ar film in the impact area.
| Original language | English |
|---|---|
| Pages (from-to) | 11730-11733 |
| Number of pages | 4 |
| Journal | Physical Review B - Condensed Matter and Materials Physics |
| Volume | 60 |
| Issue number | 16 |
| Publication status | Published - 1999 |
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ASJC Scopus subject areas
- Condensed Matter Physics
Cite this
Fragmentation and recombination of copper dimers deposited on an Ar film. / Ratner, Mark A; Harbich, W.; Fedrigo, S.
In: Physical Review B - Condensed Matter and Materials Physics, Vol. 60, No. 16, 1999, p. 11730-11733.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Fragmentation and recombination of copper dimers deposited on an Ar film
AU - Ratner, Mark A
AU - Harbich, W.
AU - Fedrigo, S.
PY - 1999
Y1 - 1999
N2 - The collision between a copper dimer and an Ar film is investigated by molecular-dynamics simulations. A dimer fragmentation rate of 24% is found for an impact kinetic energy of 25 eV per atom, in agreement with previous experimental results. Temporary dissociation of the dimer followed by a reaggregation is observed in 14% of the cases. The collision induces a fast superheating of the Ar film around the impact point followed by a liquefaction. The cooling rate of the copper dimer is found to be one order lower than the cooling rate of the Ar film in the impact area.
AB - The collision between a copper dimer and an Ar film is investigated by molecular-dynamics simulations. A dimer fragmentation rate of 24% is found for an impact kinetic energy of 25 eV per atom, in agreement with previous experimental results. Temporary dissociation of the dimer followed by a reaggregation is observed in 14% of the cases. The collision induces a fast superheating of the Ar film around the impact point followed by a liquefaction. The cooling rate of the copper dimer is found to be one order lower than the cooling rate of the Ar film in the impact area.
UR - http://www.scopus.com/inward/record.url?scp=0000366334&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0000366334&partnerID=8YFLogxK
M3 - Article
AN - SCOPUS:0000366334
VL - 60
SP - 11730
EP - 11733
JO - Physical Review B-Condensed Matter
JF - Physical Review B-Condensed Matter
SN - 1098-0121
IS - 16
ER -