Fragmentation and recombination of copper dimers deposited on an Ar film

Mark A Ratner, W. Harbich, S. Fedrigo

Research output: Contribution to journalArticle

17 Citations (Scopus)

Abstract

The collision between a copper dimer and an Ar film is investigated by molecular-dynamics simulations. A dimer fragmentation rate of 24% is found for an impact kinetic energy of 25 eV per atom, in agreement with previous experimental results. Temporary dissociation of the dimer followed by a reaggregation is observed in 14% of the cases. The collision induces a fast superheating of the Ar film around the impact point followed by a liquefaction. The cooling rate of the copper dimer is found to be one order lower than the cooling rate of the Ar film in the impact area.

Original languageEnglish
Pages (from-to)11730-11733
Number of pages4
JournalPhysical Review B - Condensed Matter and Materials Physics
Volume60
Issue number16
Publication statusPublished - 1999

Fingerprint

Dimers
Copper
fragmentation
dimers
copper
point impact
Cooling
cooling
superheating
liquefaction
collisions
Liquefaction
Kinetic energy
Molecular dynamics
kinetic energy
dissociation
molecular dynamics
Atoms
Computer simulation
atoms

ASJC Scopus subject areas

  • Condensed Matter Physics

Cite this

Fragmentation and recombination of copper dimers deposited on an Ar film. / Ratner, Mark A; Harbich, W.; Fedrigo, S.

In: Physical Review B - Condensed Matter and Materials Physics, Vol. 60, No. 16, 1999, p. 11730-11733.

Research output: Contribution to journalArticle

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