Abstract
The collision between a copper dimer and an Ar film is investigated by molecular-dynamics simulations. A dimer fragmentation rate of 24% is found for an impact kinetic energy of 25 eV per atom, in agreement with previous experimental results. Temporary dissociation of the dimer followed by a reaggregation is observed in 14% of the cases. The collision induces a fast superheating of the Ar film around the impact point followed by a liquefaction. The cooling rate of the copper dimer is found to be one order lower than the cooling rate of the Ar film in the impact area.
| Original language | English |
|---|---|
| Pages (from-to) | 11730-11733 |
| Number of pages | 4 |
| Journal | Physical Review B - Condensed Matter and Materials Physics |
| Volume | 60 |
| Issue number | 16 |
| DOIs | |
| Publication status | Published - Jan 1 1999 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
Fingerprint Dive into the research topics of 'Fragmentation and recombination of copper dimers deposited on an ar film'. Together they form a unique fingerprint.
Cite this
Ratner, M., Harbich, W., & Fedrigo, S. (1999). Fragmentation and recombination of copper dimers deposited on an ar film. Physical Review B - Condensed Matter and Materials Physics, 60(16), 11730-11733. https://doi.org/10.1103/PhysRevB.60.11730