High-angle grain-boundary junctions in YBa2Cu3O7: Normal-state resistance and 1/f noise

Li Liu, E. R. Nowak, H. M. Jaeger, B. V. Vuchic, K. L. Merkle, D. B. Buchholz, Robert P. H. Chang

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Abstract

We have investigated the normal-state resistance and the excess low-frequency (1/f) noise in 45°tilt [001] grain-boundary junctions in YBa2Cu3O7 thin films. A characteristic temperature dependence of the resistance fluctuations and a linear temperature dependence of the grain-boundary resistance (with a negative temperature coefficient) emerge as common features. These observations are quantitatively compared with a model of many, parallel conduction paths across the boundary, taking into account both temperature-independent and thermally activated transport processes.

Original languageEnglish
Pages (from-to)16164-16167
Number of pages4
JournalPhysical Review B
Volume51
Issue number22
DOIs
Publication statusPublished - 1995

ASJC Scopus subject areas

  • Condensed Matter Physics

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    Liu, L., Nowak, E. R., Jaeger, H. M., Vuchic, B. V., Merkle, K. L., Buchholz, D. B., & Chang, R. P. H. (1995). High-angle grain-boundary junctions in YBa2Cu3O7: Normal-state resistance and 1/f noise. Physical Review B, 51(22), 16164-16167. https://doi.org/10.1103/PhysRevB.51.16164