High Resolution Assembly of Patterned Metal Oxide Thin Films via Microtransfer Molding and Electrochemical Deposition Techniques

Keith J. Stevenson, Greta J. Hurtt, Joseph T Hupp

Research output: Contribution to journalArticle

23 Citations (Scopus)

Abstract

A versatile method for preparing patterned thin films of metal oxides (MoO3 and WO3) and related materials on transparent, conductive indium-tin oxide (ITO) glass platforms is reported. Micrometer-sized features are formed by microtransfer molding of an optically transparent, thermally curable epoxy on ITO substrates followed by cathodic electrodeposition of the metal oxide from aqueous metal-hydrogen peroxide solutions. Atomic force microscopy was used to characterize the resulting microstructure and to examine effects of sintering on the patterned thin films.

Original languageEnglish
Pages (from-to)175-177
Number of pages3
JournalElectrochemical and Solid-State Letters
Volume2
Issue number2-4
Publication statusPublished - Apr 1999

Fingerprint

Molding
indium oxides
tin oxides
Oxide films
metal oxides
assembly
Metals
Thin films
Oxides
high resolution
thin films
hydrogen peroxide
electrodeposition
micrometers
ITO glass
sintering
platforms
atomic force microscopy
Tin oxides
Electrodeposition

ASJC Scopus subject areas

  • Electrochemistry
  • Materials Science(all)

Cite this

High Resolution Assembly of Patterned Metal Oxide Thin Films via Microtransfer Molding and Electrochemical Deposition Techniques. / Stevenson, Keith J.; Hurtt, Greta J.; Hupp, Joseph T.

In: Electrochemical and Solid-State Letters, Vol. 2, No. 2-4, 04.1999, p. 175-177.

Research output: Contribution to journalArticle

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