Abstract
Breakdown processes in polymer dielectrics pose a limitation to energy storage and high-power operation of many electronic devices. These processes have been studied for many decades, and a great deal of progress has been made in developing phenomenological models [1]. Nonetheless, many open questions remain, particularly regarding the development of a single, unified theory to describe all stages of the breakdown process, from initiation, to sub-critical filament advance, to catastrophic breakdown and/or 'soft breakdown' [2]. To develop and validate such a detailed understanding, it is essential to first develop high-speed, spatially-resolved in situ characterization techniques. Here we demonstrate that thermoreflectance imaging [3-5] can provide such a capability for voltage stress-induced defects in self-assembled polymer nanodielectrics (SANDs) films [6]. Temporal evolution of self-heating and material blister formation for soft and catastrophic failure sites in SANDs films are imaged at submicron spatial resolution. This result shows that thermoreflectance characterization techniques provide insight into the breakdown processes determining polymer dielectric performance and reliability.
| Original language | English |
|---|---|
| Title of host publication | 75th Annual Device Research Conference, DRC 2017 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (Electronic) | 9781509063277 |
| DOIs | |
| Publication status | Published - Aug 1 2017 |
| Event | 75th Annual Device Research Conference, DRC 2017 - South Bend, United States Duration: Jun 25 2017 → Jun 28 2017 |
Other
| Other | 75th Annual Device Research Conference, DRC 2017 |
|---|---|
| Country | United States |
| City | South Bend |
| Period | 6/25/17 → 6/28/17 |
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ASJC Scopus subject areas
- Electrical and Electronic Engineering
Cite this
High temporal & spatial resolution imaging of catastrophic & soft breakdown in self-assembled nanodielectrics (SANDs) films. / Mohammed, Amr; Maize, Kerry; Stallings, Katie; Marks, Tobin J; Clarke, David; Bermel, Peter; Alam, Muhammad; Shakouri, Ali.
75th Annual Device Research Conference, DRC 2017. Institute of Electrical and Electronics Engineers Inc., 2017. 7999461.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - High temporal & spatial resolution imaging of catastrophic & soft breakdown in self-assembled nanodielectrics (SANDs) films
AU - Mohammed, Amr
AU - Maize, Kerry
AU - Stallings, Katie
AU - Marks, Tobin J
AU - Clarke, David
AU - Bermel, Peter
AU - Alam, Muhammad
AU - Shakouri, Ali
PY - 2017/8/1
Y1 - 2017/8/1
N2 - Breakdown processes in polymer dielectrics pose a limitation to energy storage and high-power operation of many electronic devices. These processes have been studied for many decades, and a great deal of progress has been made in developing phenomenological models [1]. Nonetheless, many open questions remain, particularly regarding the development of a single, unified theory to describe all stages of the breakdown process, from initiation, to sub-critical filament advance, to catastrophic breakdown and/or 'soft breakdown' [2]. To develop and validate such a detailed understanding, it is essential to first develop high-speed, spatially-resolved in situ characterization techniques. Here we demonstrate that thermoreflectance imaging [3-5] can provide such a capability for voltage stress-induced defects in self-assembled polymer nanodielectrics (SANDs) films [6]. Temporal evolution of self-heating and material blister formation for soft and catastrophic failure sites in SANDs films are imaged at submicron spatial resolution. This result shows that thermoreflectance characterization techniques provide insight into the breakdown processes determining polymer dielectric performance and reliability.
AB - Breakdown processes in polymer dielectrics pose a limitation to energy storage and high-power operation of many electronic devices. These processes have been studied for many decades, and a great deal of progress has been made in developing phenomenological models [1]. Nonetheless, many open questions remain, particularly regarding the development of a single, unified theory to describe all stages of the breakdown process, from initiation, to sub-critical filament advance, to catastrophic breakdown and/or 'soft breakdown' [2]. To develop and validate such a detailed understanding, it is essential to first develop high-speed, spatially-resolved in situ characterization techniques. Here we demonstrate that thermoreflectance imaging [3-5] can provide such a capability for voltage stress-induced defects in self-assembled polymer nanodielectrics (SANDs) films [6]. Temporal evolution of self-heating and material blister formation for soft and catastrophic failure sites in SANDs films are imaged at submicron spatial resolution. This result shows that thermoreflectance characterization techniques provide insight into the breakdown processes determining polymer dielectric performance and reliability.
UR - http://www.scopus.com/inward/record.url?scp=85028034281&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85028034281&partnerID=8YFLogxK
U2 - 10.1109/DRC.2017.7999461
DO - 10.1109/DRC.2017.7999461
M3 - Conference contribution
AN - SCOPUS:85028034281
BT - 75th Annual Device Research Conference, DRC 2017
PB - Institute of Electrical and Electronics Engineers Inc.
ER -