Impedance/dielectric spectroscopy of electroceramics in the nanograin regime

N. J. Kidner, B. J. Ingram, Z. J. Homrighaus, Thomas O Mason, E. J. Garboczi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)


In the microcrystalline regime, the behavior of grain boundary-controlled electroceramics is well described by the "brick layer model" (BLM). In the nanocrystalline regime, however, grain boundary layers can represent a significant volume fraction of the overall microstructure and simple layer models are no longer valid. This work describes the development of a pixel-based finite-difference approach to treat a "nested cube model" (NCM), which more accurately calculates the current distribution in polycrystalline ceramics when grain core and grain boundary dimensions become comparable. Furthermore, the NCM approaches layer model behavior as the volume fraction of grain cores approaches unity (thin boundary layers) and it matches standard effective medium treatments as the volume fraction of grain cores approaches zero. Therefore, the NCM can model electroceramic behavior at all grain sizes, from nanoscale to microscale. It can also be modified to handle multi-layer grain boundaries and property gradient effects (e.g., due to space charge regions).

Original languageEnglish
Title of host publicationMaterials Research Society Symposium - Proceedings
EditorsP. Knauth, J.M. Tarascon, E. Traversa, H. Tuller
Number of pages12
Publication statusPublished - 2003
EventSolid State Ionics 2002 - Boston MA, United States
Duration: Dec 2 2002Dec 5 2002


OtherSolid State Ionics 2002
CountryUnited States
CityBoston MA


ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Kidner, N. J., Ingram, B. J., Homrighaus, Z. J., Mason, T. O., & Garboczi, E. J. (2003). Impedance/dielectric spectroscopy of electroceramics in the nanograin regime. In P. Knauth, J. M. Tarascon, E. Traversa, & H. Tuller (Eds.), Materials Research Society Symposium - Proceedings (Vol. 756, pp. 39-50)