Metal-metal interfacial bonding: monolayer c(2 × 2) Cu on a Pt(001) surface

T. Kramar, R. Podloucky, A. Neckel, H. Erschbaumer, Arthur J Freeman

Research output: Contribution to journalArticle

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Abstract

First steps in understanding from first principles the underpotential electrodeposition of a metal (Cu) onto the surface of another metal (Pt) are reported. Results of local density full potential linearized augmented plane wave calculations for a slab consisting of five layers of Pt(001) with a Cu monolayer of c(2 × 2) geometry on top of each surface are presented. Minimization of the total energy as a function of the distance between the uppermost Pt layer and the Cu layer yielded a shrinkage of the CuPt nearest-neighbor distance by 13%. This result illustrates the very strong bonding between the Cu adsorbate and the Pt(001) substrate in agreement with measurements of electrochemical underpotentials. A comparison of the density of states (DOS) of the overlayer system with the DOS of an isolated slab of Pt and the DOS of a single Cu monolayer shows that energetically the Cu d-states coincide with the Pt surface states. The analysis of the bonding charge density shows a strong build up of charge in-between the CuPt neighbors, a smoothening of the corrugation, and also an increase of the Pt interlayer bonding. The nature of the chemical bonding between adsorbate and substrate atoms is examined with a discussion of the charge distribution of several special occupied electronic states.

Original languageEnglish
Pages (from-to)58-68
Number of pages11
JournalSurface Science
Volume247
Issue number1
DOIs
Publication statusPublished - May 1 1991

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Monolayers
Metals
Adsorbates
metals
slabs
Charge distribution
Surface states
Electronic states
Substrates
Charge density
Electrodeposition
shrinkage
electrodeposition
charge distribution
interlayers
plane waves
Atoms
Geometry
optimization
geometry

ASJC Scopus subject areas

  • Physical and Theoretical Chemistry
  • Condensed Matter Physics
  • Surfaces and Interfaces

Cite this

Metal-metal interfacial bonding : monolayer c(2 × 2) Cu on a Pt(001) surface. / Kramar, T.; Podloucky, R.; Neckel, A.; Erschbaumer, H.; Freeman, Arthur J.

In: Surface Science, Vol. 247, No. 1, 01.05.1991, p. 58-68.

Research output: Contribution to journalArticle

Kramar, T. ; Podloucky, R. ; Neckel, A. ; Erschbaumer, H. ; Freeman, Arthur J. / Metal-metal interfacial bonding : monolayer c(2 × 2) Cu on a Pt(001) surface. In: Surface Science. 1991 ; Vol. 247, No. 1. pp. 58-68.
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