Molecular vibrational energy relaxation at metal surfaces by picosecond infrared-visible sum spectroscopy

Alex Harris, L. Rothberg, L. H. Dubois, N. J. Levinos, L. Dhar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Time-domain experiments have been conducted to establish vibrational energy relaxation mechanisms for adsorbates at surfaces, using transient sum frequency generation (SFG). An intense resonant (IR) pump pulse vibrationally excites molecules at the surface. The subsequent population relaxation is followed by monitoring the SPG signal from a delayed pair of synchronized picosecond IR and visible probe pulses. The transient SFG experiment probes vibrational level population changes in a manner similar to familiar transient absorption experiments; the vibrationally resonant SFG nonlinear susceptibility is proportional to the population difference between the lower and upper levels of the transition. The descriptions of absorption and SFG as probes of population changes are quite similar in perturbation theory. The advantage of transient SGF measurements for surface studies is their sensitivity. Studies of methyl (CH3) groups in both large and small molecules at surfaces and methyl thiolate (CH3S) on a Ag(111) surface are reported.

Original languageEnglish
Title of host publicationXVII International Conference on Quantum Electronics. Digest of
PublisherPubl by IEEE
Pages256
Number of pages1
Publication statusPublished - 1990
Event17th International Conference on Quantum Electronics - IQEC '90 - Anaheim, CA, USA
Duration: May 21 1990May 25 1990

Other

Other17th International Conference on Quantum Electronics - IQEC '90
CityAnaheim, CA, USA
Period5/21/905/25/90

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ASJC Scopus subject areas

  • Engineering(all)

Cite this

Harris, A., Rothberg, L., Dubois, L. H., Levinos, N. J., & Dhar, L. (1990). Molecular vibrational energy relaxation at metal surfaces by picosecond infrared-visible sum spectroscopy. In XVII International Conference on Quantum Electronics. Digest of (pp. 256). Publ by IEEE.