Residual stresses and debonding of diamond films on titanium alloy substrates

L. Chandra, Manish Chhowalla, G. A J Amaratunga, T. W. Clyne

Research output: Contribution to journalArticle

31 Citations (Scopus)

Abstract

This paper is concerned with the adhesion of diamond films to titanium alloy substrates. A study is presented of the effect of prior substrate bombardment with carbon ions on the interfacial toughness. It is shown that this treatment raises the critical strain energy release rate of the interface substantially, from about 20 J m-2 to about 73 J m-2. These data have been obtained by depositing relatively thick (≈ 5 μm) diamond films on massive (1000 μm thick) Ti-6Al-4V substrates and monitoring the temperature at which these films spontaneously debonded during post-deposition cooling. The net stress levels in the films at the point of debonding were obtained by summing the calculated thermal stresses and measured intrinsic (deposition) stresses. The intrinsic stresses were measured in parallel experiments using thin (≈ 125 μm) tungsten substrates. Diamond films were deposited on these substrates under identical conditions to those for the titanium alloy substrates. The curvatures exhibited after cooling to room temperature were measured and from these the net stress levels were established. Since the tungsten is resistant to inelastic deformation while these curvatures are established, this allows evaluation of the intrinsic stress, which is taken to be the same as that for deposition on the titanium alloy substrates.

Original languageEnglish
Pages (from-to)674-681
Number of pages8
JournalDiamond and Related Materials
Volume5
Issue number6-8
Publication statusPublished - May 1996

Fingerprint

Diamond films
Debonding
titanium alloys
diamond films
Titanium alloys
residual stress
Residual stresses
Substrates
Tungsten
tungsten
curvature
strain energy release rate
Cooling
cooling
Energy release rate
toughness
thermal stresses
Strain energy
Thermal stress
Toughness

Keywords

  • Debonding
  • Residual stress
  • Titanium alloy substrates

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Materials Chemistry
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

Cite this

Residual stresses and debonding of diamond films on titanium alloy substrates. / Chandra, L.; Chhowalla, Manish; Amaratunga, G. A J; Clyne, T. W.

In: Diamond and Related Materials, Vol. 5, No. 6-8, 05.1996, p. 674-681.

Research output: Contribution to journalArticle

Chandra, L, Chhowalla, M, Amaratunga, GAJ & Clyne, TW 1996, 'Residual stresses and debonding of diamond films on titanium alloy substrates', Diamond and Related Materials, vol. 5, no. 6-8, pp. 674-681.
Chandra, L. ; Chhowalla, Manish ; Amaratunga, G. A J ; Clyne, T. W. / Residual stresses and debonding of diamond films on titanium alloy substrates. In: Diamond and Related Materials. 1996 ; Vol. 5, No. 6-8. pp. 674-681.
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