Abstract
Studies by electron and photon spectroscopy show that plasma grown GaAs oxide possesses an excess amount elemental As at the oxide - GaAs interface. This amount has been found to be inversely proportional to the growth rate. The excess elemental As is deleterious to the electrical properties of MOS devices. A selective plasma oxidation process using fluorinated oxygen gas shows that the excess As at the interface can be greatly reduced. The resultant electrical properties are also improved.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the Conference on Solid State Devices |
| Publisher | Jpn J of Appl Phys (v 19 Suppl 1 |
| Pages | 483-448 |
| Number of pages | 36 |
| Publication status | Published - 1980 |
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ASJC Scopus subject areas
- Engineering(all)
Cite this
SELECTIVE PLASMA OXIDATION OF GaAs - A STUDY OF THE INTERFACE PROPERTIES. / Chang, Robert P. H.
Proceedings of the Conference on Solid State Devices. Jpn J of Appl Phys (v 19 Suppl 1, 1980. p. 483-448.Research output: Chapter in Book/Report/Conference proceeding › Chapter
}
TY - CHAP
T1 - SELECTIVE PLASMA OXIDATION OF GaAs - A STUDY OF THE INTERFACE PROPERTIES.
AU - Chang, Robert P. H.
PY - 1980
Y1 - 1980
N2 - Studies by electron and photon spectroscopy show that plasma grown GaAs oxide possesses an excess amount elemental As at the oxide - GaAs interface. This amount has been found to be inversely proportional to the growth rate. The excess elemental As is deleterious to the electrical properties of MOS devices. A selective plasma oxidation process using fluorinated oxygen gas shows that the excess As at the interface can be greatly reduced. The resultant electrical properties are also improved.
AB - Studies by electron and photon spectroscopy show that plasma grown GaAs oxide possesses an excess amount elemental As at the oxide - GaAs interface. This amount has been found to be inversely proportional to the growth rate. The excess elemental As is deleterious to the electrical properties of MOS devices. A selective plasma oxidation process using fluorinated oxygen gas shows that the excess As at the interface can be greatly reduced. The resultant electrical properties are also improved.
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UR - http://www.scopus.com/inward/citedby.url?scp=0019269169&partnerID=8YFLogxK
M3 - Chapter
SP - 483
EP - 448
BT - Proceedings of the Conference on Solid State Devices
PB - Jpn J of Appl Phys (v 19 Suppl 1
ER -