Stabilization of copper catalysts for liquid-phase reactions by atomic layer deposition

Brandon J. O'Neill, David H K Jackson, Anthony J. Crisci, Carrie A. Farberow, Fengyuan Shi, Ana C. Alba-Rubio, Junling Lu, Paul J. Dietrich, Xiangkui Gu, Christopher L. Marshall, Peter C Stair, Jeffrey W. Elam, Jeffrey T. Miller, Fabio H. Ribeiro, Paul M. Voyles, Jeffrey Greeley, Manos Mavrikakis, Susannah L. Scott, Thomas F. Kuech, James A. Dumesic

Research output: Contribution to journalArticle

100 Citations (Scopus)

Abstract

Atomic layer deposition (ALD) of an alumina overcoat can stabilize a base metal catalyst (e.g., copper) for liquid-phase catalytic reactions (e.g., hydrogenation of biomass-derived furfural in alcoholic solvents or water), thereby eliminating the deactivation of conventional catalysts by sintering and leaching. This method of catalyst stabilization alleviates the need to employ precious metals (e.g., platinum) in liquid-phase catalytic processing. The alumina overcoat initially covers the catalyst surface completely. By using solid state NMR spectroscopy, X-ray diffraction, and electron microscopy, it was shown that high temperature treatment opens porosity in the overcoat by forming crystallites of γ-Al2O3. Infrared spectroscopic measurements and scanning tunneling microscopy studies of trimethylaluminum ALD on copper show that the remarkable stability imparted to the nanoparticles arises from selective armoring of under-coordinated copper atoms on the nanoparticle surface. Catalytic Armoring: Atomic layer deposition (ALD) of alumina overcoats has been employed to stabilize base metal catalysts against sintering and leaching in liquid-phase conditions. Kinetic studies, characterization of the materials, and theoretical studies were used to elucidate the mechanism by which this stabilization of base metal nanoparticles is achieved.

Original languageEnglish
Pages (from-to)13808-13812
Number of pages5
JournalAngewandte Chemie - International Edition
Volume52
Issue number51
DOIs
Publication statusPublished - Dec 16 2013

Fingerprint

Atomic layer deposition
Copper
Stabilization
Aluminum Oxide
Catalysts
Liquids
Alumina
Leaching
Sintering
Metals
Furaldehyde
Nanoparticles
Furfural
Metal nanoparticles
Scanning tunneling microscopy
Precious metals
Platinum
Crystallites
Electron microscopy
Nuclear magnetic resonance spectroscopy

Keywords

  • atomic layer deposition
  • biomass
  • catalyst stability
  • copper
  • hydrogenation

ASJC Scopus subject areas

  • Chemistry(all)
  • Catalysis

Cite this

O'Neill, B. J., Jackson, D. H. K., Crisci, A. J., Farberow, C. A., Shi, F., Alba-Rubio, A. C., ... Dumesic, J. A. (2013). Stabilization of copper catalysts for liquid-phase reactions by atomic layer deposition. Angewandte Chemie - International Edition, 52(51), 13808-13812. https://doi.org/10.1002/anie.201308245

Stabilization of copper catalysts for liquid-phase reactions by atomic layer deposition. / O'Neill, Brandon J.; Jackson, David H K; Crisci, Anthony J.; Farberow, Carrie A.; Shi, Fengyuan; Alba-Rubio, Ana C.; Lu, Junling; Dietrich, Paul J.; Gu, Xiangkui; Marshall, Christopher L.; Stair, Peter C; Elam, Jeffrey W.; Miller, Jeffrey T.; Ribeiro, Fabio H.; Voyles, Paul M.; Greeley, Jeffrey; Mavrikakis, Manos; Scott, Susannah L.; Kuech, Thomas F.; Dumesic, James A.

In: Angewandte Chemie - International Edition, Vol. 52, No. 51, 16.12.2013, p. 13808-13812.

Research output: Contribution to journalArticle

O'Neill, BJ, Jackson, DHK, Crisci, AJ, Farberow, CA, Shi, F, Alba-Rubio, AC, Lu, J, Dietrich, PJ, Gu, X, Marshall, CL, Stair, PC, Elam, JW, Miller, JT, Ribeiro, FH, Voyles, PM, Greeley, J, Mavrikakis, M, Scott, SL, Kuech, TF & Dumesic, JA 2013, 'Stabilization of copper catalysts for liquid-phase reactions by atomic layer deposition', Angewandte Chemie - International Edition, vol. 52, no. 51, pp. 13808-13812. https://doi.org/10.1002/anie.201308245
O'Neill BJ, Jackson DHK, Crisci AJ, Farberow CA, Shi F, Alba-Rubio AC et al. Stabilization of copper catalysts for liquid-phase reactions by atomic layer deposition. Angewandte Chemie - International Edition. 2013 Dec 16;52(51):13808-13812. https://doi.org/10.1002/anie.201308245
O'Neill, Brandon J. ; Jackson, David H K ; Crisci, Anthony J. ; Farberow, Carrie A. ; Shi, Fengyuan ; Alba-Rubio, Ana C. ; Lu, Junling ; Dietrich, Paul J. ; Gu, Xiangkui ; Marshall, Christopher L. ; Stair, Peter C ; Elam, Jeffrey W. ; Miller, Jeffrey T. ; Ribeiro, Fabio H. ; Voyles, Paul M. ; Greeley, Jeffrey ; Mavrikakis, Manos ; Scott, Susannah L. ; Kuech, Thomas F. ; Dumesic, James A. / Stabilization of copper catalysts for liquid-phase reactions by atomic layer deposition. In: Angewandte Chemie - International Edition. 2013 ; Vol. 52, No. 51. pp. 13808-13812.
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