Structure and bonding issues at the interface between gold and self-assembled conjugated dithiol monolayers

Weirong Jiang, Nikolai Zhitenev, Zhenan Bao, Hong Meng, David Abusch-Magder, Don Tennant, Eric Garfunkel

Research output: Contribution to journalArticle

29 Citations (Scopus)

Abstract

Organic thiols have received extensive attention recently because of their relative stability and ease of examination compared to other potential molecular electronic materials. In this work, scanning probe microscopy (SPM) is used to study (i) the structural properties of self-assembled monolayers (SAMs) containing conjugated dithiols and (ii) the formation of the upper molecule-metal interface on dithiol SAMs. The top gold film is deposited either by thermal evaporation or by nano-transfer printing (nTP). Generally, the utility of thermal evaporation is limited because of Au diffusion through the SAMs. However, several dithiol SAMs are identified in this work that bond well to Au overlayers and act as satisfactory diffusion barriers. Coassembly of conjugated dithiols and alkanemonothiols is suggested as a route to obtain dithiols that are denser packed and more vertical (than is obtained from pure dithiol routes). High-yield nTP is demonstrated on coassembled SAMs. Advantages and limitations of different Au deposition and transfer techniques are compared on a variety of length scales.

Original languageEnglish
Pages (from-to)8751-8757
Number of pages7
JournalLangmuir
Volume21
Issue number19
DOIs
Publication statusPublished - Sep 13 2005

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Spectroscopy
  • Electrochemistry

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