Abstract
Organic thiols have received extensive attention recently because of their relative stability and ease of examination compared to other potential molecular electronic materials. In this work, scanning probe microscopy (SPM) is used to study (i) the structural properties of self-assembled monolayers (SAMs) containing conjugated dithiols and (ii) the formation of the upper molecule-metal interface on dithiol SAMs. The top gold film is deposited either by thermal evaporation or by nano-transfer printing (nTP). Generally, the utility of thermal evaporation is limited because of Au diffusion through the SAMs. However, several dithiol SAMs are identified in this work that bond well to Au overlayers and act as satisfactory diffusion barriers. Coassembly of conjugated dithiols and alkanemonothiols is suggested as a route to obtain dithiols that are denser packed and more vertical (than is obtained from pure dithiol routes). High-yield nTP is demonstrated on coassembled SAMs. Advantages and limitations of different Au deposition and transfer techniques are compared on a variety of length scales.
| Original language | English |
|---|---|
| Pages (from-to) | 8751-8757 |
| Number of pages | 7 |
| Journal | Langmuir |
| Volume | 21 |
| Issue number | 19 |
| DOIs | |
| Publication status | Published - Sep 13 2005 |
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ASJC Scopus subject areas
- Physical and Theoretical Chemistry
- Colloid and Surface Chemistry
Cite this
Structure and bonding issues at the interface between gold and self-assembled conjugated dithiol monolayers. / Jiang, Weirong; Zhitenev, Nikolai; Bao, Zhenan; Meng, Hong; Abusch-Magder, David; Tennant, Don; Garfunkel, Eric.
In: Langmuir, Vol. 21, No. 19, 13.09.2005, p. 8751-8757.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Structure and bonding issues at the interface between gold and self-assembled conjugated dithiol monolayers
AU - Jiang, Weirong
AU - Zhitenev, Nikolai
AU - Bao, Zhenan
AU - Meng, Hong
AU - Abusch-Magder, David
AU - Tennant, Don
AU - Garfunkel, Eric
PY - 2005/9/13
Y1 - 2005/9/13
N2 - Organic thiols have received extensive attention recently because of their relative stability and ease of examination compared to other potential molecular electronic materials. In this work, scanning probe microscopy (SPM) is used to study (i) the structural properties of self-assembled monolayers (SAMs) containing conjugated dithiols and (ii) the formation of the upper molecule-metal interface on dithiol SAMs. The top gold film is deposited either by thermal evaporation or by nano-transfer printing (nTP). Generally, the utility of thermal evaporation is limited because of Au diffusion through the SAMs. However, several dithiol SAMs are identified in this work that bond well to Au overlayers and act as satisfactory diffusion barriers. Coassembly of conjugated dithiols and alkanemonothiols is suggested as a route to obtain dithiols that are denser packed and more vertical (than is obtained from pure dithiol routes). High-yield nTP is demonstrated on coassembled SAMs. Advantages and limitations of different Au deposition and transfer techniques are compared on a variety of length scales.
AB - Organic thiols have received extensive attention recently because of their relative stability and ease of examination compared to other potential molecular electronic materials. In this work, scanning probe microscopy (SPM) is used to study (i) the structural properties of self-assembled monolayers (SAMs) containing conjugated dithiols and (ii) the formation of the upper molecule-metal interface on dithiol SAMs. The top gold film is deposited either by thermal evaporation or by nano-transfer printing (nTP). Generally, the utility of thermal evaporation is limited because of Au diffusion through the SAMs. However, several dithiol SAMs are identified in this work that bond well to Au overlayers and act as satisfactory diffusion barriers. Coassembly of conjugated dithiols and alkanemonothiols is suggested as a route to obtain dithiols that are denser packed and more vertical (than is obtained from pure dithiol routes). High-yield nTP is demonstrated on coassembled SAMs. Advantages and limitations of different Au deposition and transfer techniques are compared on a variety of length scales.
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U2 - 10.1021/la0474316
DO - 10.1021/la0474316
M3 - Article
VL - 21
SP - 8751
EP - 8757
JO - Langmuir
JF - Langmuir
SN - 0743-7463
IS - 19
ER -