Substrate-suppressed phase transition in nano-crystalline BaTiO3 thin films

J. P. Nair, N. Stavitski, I. Zon, K. Gartsman, Igor Lubomirsky, A. L. Roytburd

Research output: Contribution to journalArticle

10 Citations (Scopus)

Abstract

Upon substrate removal nano-crystalline cubic BaTiO3 thin films transformed into the tetragonal phase. Randomly oriented nano-crystalline BaTiO3 films were prepared with moderate residual tensile stress by sol-gel processing or RF sputtering. The low dielectric constant (110 ± 20) and the X-ray diffraction spectra identified the films as being cubic at room temperature. Despite the tensile stress in the substrate-supported films, the free-standing films became corrugated, indicating 0.3-0.5% lateral expansion. The fact that the cubic-to-tetragonal phase transition was responsible for the lateral expansion has been confirmed by a fivefold increase of the dielectric constant (620 ± 10) and a detectable piezoelectric effect.

Original languageEnglish
Pages (from-to)782-787
Number of pages6
JournalEurophysics Letters
Volume60
Issue number5
DOIs
Publication statusPublished - Dec 2002

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thin films
tensile stress
permittivity
expansion
residual stress
sputtering
gels
room temperature
diffraction
x rays

ASJC Scopus subject areas

  • Physics and Astronomy(all)

Cite this

Substrate-suppressed phase transition in nano-crystalline BaTiO3 thin films. / Nair, J. P.; Stavitski, N.; Zon, I.; Gartsman, K.; Lubomirsky, Igor; Roytburd, A. L.

In: Europhysics Letters, Vol. 60, No. 5, 12.2002, p. 782-787.

Research output: Contribution to journalArticle

Nair, JP, Stavitski, N, Zon, I, Gartsman, K, Lubomirsky, I & Roytburd, AL 2002, 'Substrate-suppressed phase transition in nano-crystalline BaTiO3 thin films', Europhysics Letters, vol. 60, no. 5, pp. 782-787. https://doi.org/10.1209/epl/i2002-00376-7
Nair, J. P. ; Stavitski, N. ; Zon, I. ; Gartsman, K. ; Lubomirsky, Igor ; Roytburd, A. L. / Substrate-suppressed phase transition in nano-crystalline BaTiO3 thin films. In: Europhysics Letters. 2002 ; Vol. 60, No. 5. pp. 782-787.
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