Summary Abstract: Bridging the gap between solid-solid and solid-vacuum interfaces: A study of buried Si/αSi interfaces

H. J. Gossmann; J. M. Gibson; J. C. Bean; R. T. Tung; Leonard C Feldman

doi:10.1116/1.574592

Summary Abstract: Bridging the gap between solid-solid and solid-vacuum interfaces: A study of buried Si/αSi interfaces

H. J. Gossmann, J. M. Gibson, J. C. Bean, R. T. Tung, Leonard C Feldman

Rutgers University

Research output: Contribution to journal › Article

1 Citation (Scopus)

Original language	English
Pages (from-to)	1509-1510
Number of pages	2
Journal	Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Volume	5
Issue number	4
DOIs	https://doi.org/10.1116/1.574592
Publication status	Published - Jul 1 1987

ASJC Scopus subject areas

Condensed Matter Physics
Surfaces and Interfaces
Surfaces, Coatings and Films

Access to Document

10.1116/1.574592

Cite this

Gossmann, H. J., Gibson, J. M., Bean, J. C., Tung, R. T., & Feldman, L. C. (1987). Summary Abstract: Bridging the gap between solid-solid and solid-vacuum interfaces: A study of buried Si/αSi interfaces. Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films, 5(4), 1509-1510. https://doi.org/10.1116/1.574592

Summary Abstract : Bridging the gap between solid-solid and solid-vacuum interfaces: A study of buried Si/αSi interfaces. / Gossmann, H. J.; Gibson, J. M.; Bean, J. C.; Tung, R. T.; Feldman, Leonard C.

In: Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films, Vol. 5, No. 4, 01.07.1987, p. 1509-1510.

Research output: Contribution to journal › Article

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