The effect of a partially wetting second phase on conduction

Research output: Contribution to journalArticle

Abstract

The conduction behavior in a realistic three- dimensional two- phase microstructure is examined. Specifically, the case of a nonconducting, partially wetting second phase is examined. An electrical circuit analogue is used to quantitatively measure the effect. The dihedral angle that the second phase makes at grain boundaries is found to significantly influence the conductivity. As the second phase penetrates deeper into the grain boundary region, the conduction pathways are restricted to a greater degree. This is important for microstructures that result from a variety of standard processing techniques that in volve the presence of liquid phases during heat treatment.

Original languageEnglish
Pages (from-to)75-80
Number of pages6
JournalJournal of Materials Engineering and Performance
Volume2
Issue number1
DOIs
Publication statusPublished - Feb 1993

Fingerprint

Wetting
Grain boundaries
Microstructure
Dihedral angle
Heat treatment
Networks (circuits)
Liquids
Processing

Keywords

  • composite/microstructure
  • dihedral angle
  • electrical conduction
  • grain boundaries
  • processing
  • sintering
  • sintering microstructure
  • thermal conduction

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

The effect of a partially wetting second phase on conduction. / Birnie, Dunbar P.

In: Journal of Materials Engineering and Performance, Vol. 2, No. 1, 02.1993, p. 75-80.

Research output: Contribution to journalArticle

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