Abstract
The conduction behavior in a realistic three- dimensional two- phase microstructure is examined. Specifically, the case of a nonconducting, partially wetting second phase is examined. An electrical circuit analogue is used to quantitatively measure the effect. The dihedral angle that the second phase makes at grain boundaries is found to significantly influence the conductivity. As the second phase penetrates deeper into the grain boundary region, the conduction pathways are restricted to a greater degree. This is important for microstructures that result from a variety of standard processing techniques that in volve the presence of liquid phases during heat treatment.
| Original language | English |
|---|---|
| Pages (from-to) | 75-80 |
| Number of pages | 6 |
| Journal | Journal of Materials Engineering and Performance |
| Volume | 2 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - Feb 1993 |
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Keywords
- composite/microstructure
- dihedral angle
- electrical conduction
- grain boundaries
- processing
- sintering
- sintering microstructure
- thermal conduction
ASJC Scopus subject areas
- Materials Science(all)
- Mechanics of Materials
- Mechanical Engineering
Cite this
The effect of a partially wetting second phase on conduction. / Birnie, Dunbar P.
In: Journal of Materials Engineering and Performance, Vol. 2, No. 1, 02.1993, p. 75-80.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - The effect of a partially wetting second phase on conduction
AU - Birnie, Dunbar P
PY - 1993/2
Y1 - 1993/2
N2 - The conduction behavior in a realistic three- dimensional two- phase microstructure is examined. Specifically, the case of a nonconducting, partially wetting second phase is examined. An electrical circuit analogue is used to quantitatively measure the effect. The dihedral angle that the second phase makes at grain boundaries is found to significantly influence the conductivity. As the second phase penetrates deeper into the grain boundary region, the conduction pathways are restricted to a greater degree. This is important for microstructures that result from a variety of standard processing techniques that in volve the presence of liquid phases during heat treatment.
AB - The conduction behavior in a realistic three- dimensional two- phase microstructure is examined. Specifically, the case of a nonconducting, partially wetting second phase is examined. An electrical circuit analogue is used to quantitatively measure the effect. The dihedral angle that the second phase makes at grain boundaries is found to significantly influence the conductivity. As the second phase penetrates deeper into the grain boundary region, the conduction pathways are restricted to a greater degree. This is important for microstructures that result from a variety of standard processing techniques that in volve the presence of liquid phases during heat treatment.
KW - composite/microstructure
KW - dihedral angle
KW - electrical conduction
KW - grain boundaries
KW - processing
KW - sintering
KW - sintering microstructure
KW - thermal conduction
UR - http://www.scopus.com/inward/record.url?scp=51649145345&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=51649145345&partnerID=8YFLogxK
U2 - 10.1007/BF02649677
DO - 10.1007/BF02649677
M3 - Article
AN - SCOPUS:51649145345
VL - 2
SP - 75
EP - 80
JO - Journal of Materials Engineering and Performance
JF - Journal of Materials Engineering and Performance
SN - 1059-9495
IS - 1
ER -