The role of interfacial charge transfer-type interactions in the decay of plasmon excitations in metal nanoparticles

Kenneth O. Aruda, Mario Tagliazucchi, Christina M. Sweeney, Daniel C. Hannah, Emily A Weiss

Research output: Contribution to journalArticle

34 Citations (Scopus)

Abstract

This perspective describes the influence of interfacial charge transfer-type interactions on the optical spectra and hot electron cooling processes in plasmonic nanoparticles (NPs), and ongoing work to optimize these interactions for charge extraction from the plasmon or hot electron state. The manuscript focuses on interfaces of metal NPs with organic molecules and with semiconductors. Charge extraction from multi-electron excited states has applications in photodetection, sensing, and conversion of solar energy to electricity and fuels.

Original languageEnglish
Pages (from-to)7441-7449
Number of pages9
JournalPhysical Chemistry Chemical Physics
Volume15
Issue number20
DOIs
Publication statusPublished - May 28 2013

Fingerprint

Hot electrons
Metal nanoparticles
Charge transfer
charge transfer
hot electrons
nanoparticles
decay
Excited states
metals
Solar energy
Electron energy levels
excitation
electrons
Electricity
solar energy
interactions
Semiconductor materials
Nanoparticles
electron states
electricity

ASJC Scopus subject areas

  • Physical and Theoretical Chemistry
  • Physics and Astronomy(all)

Cite this

The role of interfacial charge transfer-type interactions in the decay of plasmon excitations in metal nanoparticles. / Aruda, Kenneth O.; Tagliazucchi, Mario; Sweeney, Christina M.; Hannah, Daniel C.; Weiss, Emily A.

In: Physical Chemistry Chemical Physics, Vol. 15, No. 20, 28.05.2013, p. 7441-7449.

Research output: Contribution to journalArticle

Aruda, Kenneth O. ; Tagliazucchi, Mario ; Sweeney, Christina M. ; Hannah, Daniel C. ; Weiss, Emily A. / The role of interfacial charge transfer-type interactions in the decay of plasmon excitations in metal nanoparticles. In: Physical Chemistry Chemical Physics. 2013 ; Vol. 15, No. 20. pp. 7441-7449.
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