Thermoelectric module for low temperature applications

Sangeeta Lal, Sim Loo, Duck Young Chung, Theodora Kyratsi, Mercouri G Kanatzidis, Charles Cauchy, Timothy P. Hogan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

The possibility of a prototype thermoelectric cooling device for operation near liquid nitrogen temperatures has been explored. In these devices, the figure of merit involves a combination of the properties of the two branches of the module. Here, we investigate the fabrication of a module with a new low temperature material, CsBi4Te6 (p-type), and the best known low temperature n-type materials Bi85Sb15. Transport measurements for each of these materials show high performance at low temperatures. Known values for the figure of merit Zmax of CsBi4Te6 3.5 × 10-3 K-1 at 225K and for Bi85Sb15 is 6.5 × 10-3; K-1 at 77K. At 100K these values drop to 2.0 × 10-3 K-1 for CsBi4Te6 and 6.0 × 10-3 K-1 for Bi85Sb15. Theoretical simulations based on these data show a cooling of ΔT = 12K at 100K, which is almost three times the efficiency of a Bi2Te3 module at that temperature. We present transport measurements of elements used in the fabrication of a low temperature thermoelectric module and properties of the resulting module.

Original languageEnglish
Title of host publicationMaterials Research Society Symposium - Proceedings
Pages121-129
Number of pages9
Volume691
Publication statusPublished - 2002
EventThermoelectric Materials 2001-Research and Applications - Boston, MA, United States
Duration: Nov 26 2001Nov 29 2001

Other

OtherThermoelectric Materials 2001-Research and Applications
CountryUnited States
CityBoston, MA
Period11/26/0111/29/01

Fingerprint

Temperature
Cooling
Fabrication
Liquid nitrogen

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Lal, S., Loo, S., Chung, D. Y., Kyratsi, T., Kanatzidis, M. G., Cauchy, C., & Hogan, T. P. (2002). Thermoelectric module for low temperature applications. In Materials Research Society Symposium - Proceedings (Vol. 691, pp. 121-129)

Thermoelectric module for low temperature applications. / Lal, Sangeeta; Loo, Sim; Chung, Duck Young; Kyratsi, Theodora; Kanatzidis, Mercouri G; Cauchy, Charles; Hogan, Timothy P.

Materials Research Society Symposium - Proceedings. Vol. 691 2002. p. 121-129.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Lal, S, Loo, S, Chung, DY, Kyratsi, T, Kanatzidis, MG, Cauchy, C & Hogan, TP 2002, Thermoelectric module for low temperature applications. in Materials Research Society Symposium - Proceedings. vol. 691, pp. 121-129, Thermoelectric Materials 2001-Research and Applications, Boston, MA, United States, 11/26/01.
Lal S, Loo S, Chung DY, Kyratsi T, Kanatzidis MG, Cauchy C et al. Thermoelectric module for low temperature applications. In Materials Research Society Symposium - Proceedings. Vol. 691. 2002. p. 121-129
Lal, Sangeeta ; Loo, Sim ; Chung, Duck Young ; Kyratsi, Theodora ; Kanatzidis, Mercouri G ; Cauchy, Charles ; Hogan, Timothy P. / Thermoelectric module for low temperature applications. Materials Research Society Symposium - Proceedings. Vol. 691 2002. pp. 121-129
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